雷射設備

Application: 

•Cutting Metal Traces, Si wafer, SiO2 film

•Removing passivation, oxide and metal layers

•Removing ITO shorts

Application: 

•Cutting Metal Traces, Glass, Si wafer, SiO2, SiN, SiC, AlN, Polymer, GaAs (III-V) components

•Removing passivation, oxide and metal layers

•Welding & Sealing

•Surface treatment

特色: 

•精準對位、in-situ雷射對位

•可配置不同光源使用:皮秒、UV、NIR

可用於Pattern wafer  切割、試片準備

Application: 

•Silicon、SiC、GaN、Glasss 切割

•顯微鏡倍率 5X~1000X

•可用於Pattern wafer  切割、試片準備

•高度、大小可調試