公司產品

JYM 雷射切割機 (簡易版)

Application:

•Cutting Metal Traces, Si wafer, SiO2 film

•Removing passivation, oxide and metal layers

•Removing ITO shorts

JYM 雷射切割機 (市售版)

Application:

•Cutting Metal Traces, Glass, Si wafer, SiO2, SiN, SiC, AlN, Polymer, GaAs (III-V) components

•Removing passivation, oxide and metal layers

•Welding & Sealing

•Surface treatment

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